Financial Support for DFG-Funded Research during the Coronavirus Pandemic

In view of the continuing adverse effects of the coronavirus pandemic, the DFG Joint Committee has approved an extension of financial support for DFG-funded research projects approved last year in addition to an expansion of measures in certain programme areas.

Source

Each PI of a FFlexCom project can individually apply until June 21st 2021 for a project extension as well as additional personnel and material funds, to compensate delays caused by the effects of the coronavirus pandemic.

The required application form is the DFG Form 41.48, which has to be submitted via the elan-portal. More information can be found here, where specifically section „Research Groups and Priority Programmes“ is releveant.

Phase II – Proposal Presentations

FFlexCom Phase II

Proposal Presentations for the Second Three-Year Term of FFlexCom

The applicants will present their proposals for the second three-year term in Dresden on 5th of June 2018.

You have to submit your presentation file already on the 3rd of June 2018 to fflexcom [at] tu-dresden.de.

The agenda and the letter of invitation is available to members in the documents section of the members area.

Call for Papers – EuMA IJMWT – Special Issue

EuMA - European Microwave Association

Call for Papers – EuMA IJMWT – Special Issue on Flexible Electronics for Wireless Communication Systems

International Journal of Microwave and Wireless Technologies

Special Issue on
Flexible Electronics for Wireless Communication Systems

The International Journal of Microwave and Wireless Technologies is soliciting articles for a
Special Issue, which will cover all subjects related to Flexible Electronics for Wireless
Communication Systems. Manuscripts should be 6-8 pages in length, including figures and
references.

Relevant topics of interest include, but are not limited to:

  • Emerging mechanically flexible RFIC technologies
  • TOLAE technologies
  • Metal-Oxide technologies
  • Carbon allotrope technologies
  • Thinned silicon technologies
  • Flexible packaging and integration
  • RF characterization and modelling of devices, including integrated antennas
  • RF system and circuit design; Emerging applications.

Submission dead line: October 18, 2018.
The call for papers can be downloaded here.  
Instructions for authors can be found on the journal’s webpage.
Submission will be via manuscriptcentral.

FFlexCom Phase II

CFP Phase II

FFlexCom Phase II

Call for Proposal of Second Three-Year Term of FFlexCom

Proposals for the second three-year term must be written in English and submitted to the DFG by 16 January 2018.

Applicants must be registered in elan prior to submitting a proposal to the DFG. If you have not yet registered, please note that you must do so by 2 January 2018 to submit a proposal under this call.

The call for proposal with detailed information can be accessed here:
http://www.dfg.de/foerderung/info_wissenschaft/2017/info_wissenschaft_17_63/